JP
7480 74111110101115
I made up a few batches of my boards over the last couple days, and thought there may be some interest in how it's done.
First up is the jig, which holds the board and the stencils. The boards are the size of a .6 wide DIP 28 package.
This is a closeup of the QFN 20 footprint, which is the PIC uC (6x magnification):
And this is the alignment pin and stencil at 6x. It's a rather high-tolerance fit.
This is the QFN 20 footprint with the stencil over the board:
Next we lay down some solder paste and squeegee it over the board:
Close-up of the stencil with the paste applied:
And a close-up of the board with the paste applied after removing the stencil:
First up is the jig, which holds the board and the stencils. The boards are the size of a .6 wide DIP 28 package.
This is a closeup of the QFN 20 footprint, which is the PIC uC (6x magnification):
And this is the alignment pin and stencil at 6x. It's a rather high-tolerance fit.
This is the QFN 20 footprint with the stencil over the board:
Next we lay down some solder paste and squeegee it over the board:
Close-up of the stencil with the paste applied:
And a close-up of the board with the paste applied after removing the stencil: