Thanks for the reply Leestereo, I do see your point.
Thanks, both of you, for showing me my error. :thmbsp:
I have now removed re cleaned and reinstalled the transistors using a minimal smeared amount of compound.
I don't want to start a fight here, but I'll put across my way of thinking. Please tell me where I am going wrong with my thought process. :yes:
The way i look at it, if you apply more compound than necessary in this application (like I did previously), surly it wouldn't matter because the compound would squidge out the same as if it were applied thinner anyway? These aren't clipped down CPU chips that are likely to sit on top of the compound, they are screwed down transistors and are fitted down alot tighter? I thought the idea being not to get any air bubbles or dry spots between transistor, washer and heatsink? I would have thought a compound joint is better than a dry one? Anyway what is thermal compound designed to do, conduct heat? :scratch2:
Please understand I am not being short here, I just want to learn where I am going wrong with my thought process. I welcome criticism. :yes: every day is a day at school.
I know it looks rough but it can be wiped away afterwards.
Edit: This thermal compound really is not that viscous any light pressure and it moves away from the pressure point. Its more like my wife's face cream for thickness than a thick grease.