Dearslayer
Super Member
Just started the recap on my 2230. This unit sounds pretty good already, and is very clean on the internals but it’s one of few units I have that was in the que to be recapped to hand down to my kids someday. Is it the opinion of most that it’s better to remove Printed Circuit Boards completely for recapping or is it ok to remove as little as possible and just enough to gain the necessary access as long as there is no strain put on the remaining wires left connected? I would think that complete removal has the most advantages for ease of recapping and cleaning etc but if things aren’t really dirty is it the norm to recap in place? So now on to the recapping questions. I finished the Power supply without much issues and I’m in the process of the 750 amp boards. I’m following a BOM list ( thanks to Mburas ) and the old cap at C757 was a 50V 22uF ( as seen in the picture below ) however the list I’m following has the new cap at 50V 33uF. The Service manual has it at 35V 22uF, so not sure if there is an error in the SM or if the cap had already been replace at some point before my pocession. Is it ok to increase the value on both the Voltage and uF on this cap? Next question…. When I do finish this board and reassemble ,do I apply Thermal compound to the thick plastic gasket ( doesn’t look as though there was ever any there ) on the underside of the output Transistor ( is that the proper name ) or just on the Mica gasket where it contacts the heat sink and transistor on the outside of the Heatsink as shown in the pictures below. I can see where the old paste has dried on both sides of the Mica gasket so I know that it has to be done again but the other thick plastic gasket where the wires attach I’m not sure about.