I don't know about most solder for electronics, but apparently 60/40 is not actually eutectic, while 63/37 is eutectic.
https://fctsolder.com/eutectic-solder/
https://ae5x.blogspot.com/2019/12/eutectic-or-non-eutectic-solder-does-it.html
However, 60/40 is very close to eutectic, which means that cooling solder passes through the plastic region very quickly. 60/40 may also be slightly better at "wetting" soldered surfaces, and is apparently less expensive.
In the end, whether you choose 60/40, 63/37, or a silver bearing solder such as Cardas or Wonder Solder, the quality of results is mainly dependent on your soldering technique, which includes using a sufficiently high iron temperature and appropriate tip to permit rapid heating of the work and solder flow. As pointed out elsewhere, thanks
@Bratwurst7s, rapid heating of the work area, over less time, reduces the amount of heat that flows to adjacent areas, preventing traces from being lifted and damage to components.
Another reason that the iron temperature should be considerably higher than the melting point of the solder, is to activate the flux. The flux (whether in core or added) needs to get hot enough to work properly, and quickly. The flux helps the solder to flow and allows you to make a good joint in less time, reducing the heating of the components and board.
In my own limited experience, I find that iron temperatures between 680 and 700 seem to work best. If I am desoldering, the temperature will be at the high end of the range, and I add fresh solder to improve the heat transfer and lower the melting point of the old solder. If I am assembling, I generally lower the temperature somewhat. Larger solder joints require iron temperature at the high end, otherwise it takes too long to heat the material, melt the solder, and activate the flux. As long as you are not making cold solder joints, it is safer to work faster rather than slower.