That's a really good tip about the using the locations in the customer part number. Just for reference, you should always try and avoid wherever possible soldering from the top and bottom side of a component joint as it risks flux entrapment in the solder joint. Sometimes I appreciate that heavy tracking or ground planes can make it difficult but worse case as long as you are getting flow though to about 75% of the board thickness then you will be fine. In most cases it will flow through without encountering this problem anyway. I always solder on the underside as it less likely to damage adjacent components.

