I do pin them to reduce the chances of solder shrinkage over time. (I want NO comebacks biting me down the road) But simply sucking off the old solder and fresh resoldering works fine as long as you're sure both sides are good.As I have said in earlier posts, there is almost always issues with the feedthroughs on the F-2634. I do not pin them, I just make a large solder fillet between the rivet and the foil, on both sides of the board. I have never seen where a rivet is open in the middle, so I see no reason to place a wire through the rivet. The issue (IMHO) is that the board was wave soldered when manufactured, and this provided only a very thin membrane of solder between the rivet and the foil, which has fractured with a "ring crack" after many heat cool thermal cycles.. You can physically see the "ring crack" issue on many of the rivets. Creating a thick solder bridge between the foil and rivet prevents this from reoccurring, the same way hand soldering ring cracks around stake pins connectors and component leads prevents reoccurrence of ring cracks
I also sometimes see issues with noisy / intermittent transistors on the F-2087 QS matrix PC board. They are the ones where the leads turn black, and IMHO develop a noisy leakage path between leads across the transistor body due to the plating migrating onto the body as it tarnishes (see photos). Many times the leakage path is not visible though.
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